Product DescriptionThis auction is for a K&S (Kulicke & Soffa) 4524A Digital Manual Ball Wire Bonder (m/n 4524-AD, s/n 6402, mfd. 02/98; 115VAC, 50/60Hz, 4.0A), as shown. It looks to be in very good cosmetic condition, and it seems to be working properly, but my technician will be coming by this week to go thru it and make sure everything is up to factory specs. It features a heated workholder, a Leica MZ6 Binocular Zoom Microscope (0.63X to 4.0X) with a pair of 16X/14B eyepieces, and a Volpi Intralux 4000-1 Illuminator. For more information on this bonder, please click here. Sold as-is. •Choice of Mouse Position and Manual Z configuration. - Left-Hand Mouse with Right-Hand Manual Z Lever - Right-Hand Mouse with Left-Hand Manual Z Lever - Right-Hand Mouse with Integrated Manual Z (Multi-Mouse) •Independent Manual Z axis control, separate from X and Y axis control. •Independently adjustable Wire Parameters, up to 6 channels - Separate Force control for each bond, adjustable and independent per channel. - Separate Bond Time control for each bond. - Separate Bond Power control for each bond •No springs are used to apply force; digitally controlled components are utilized. •Digital Programmable per-wire Bond Programs (Recipes) - Up to 200 Bond Program storage - Non-volatile RAM; programs will not self-erase - 6 independent Bond Channels; include all parameters - Multi-Wire capable; up to 3-wire Program capability •Digitally Controlled NEFO - Taken directly from K&S 8000-Series Automatic Ball Bonders - Auto-Stop NEFO ‘error’ functions; detects ‘open’ or ‘short’ error conditions •Auto 2nd Bond - Programmable 2nd bond step, with automatic 2nd bond completion •Deep Access Kit is available - Factory or Field retrofit - Uses 0.625” bond tool length with 0.500” Z travel Access up to 0.470” deep for most applications •Motorized Wire Clamp Motion with Linear Stepper Motor •Auto-Stepback Mode is included, with a motorized Y stage •Ball Bump/ TAB bonding/ Coining functions are included - Operates in Manual Z mode - Operates in Auto 2nd bond mode Automatically perform up to 6 bonds •Dedicated TAB Bond Head is available - Factory installed or Field retrofit •No vacuum or air pressure is required for operation. •Built-in Operator Armrests for ergonomic comfort. •Standard Reset Height is .360” with full range fine Z Motion control. Deep Access Reset Height is .500” for deep package bonding. •Wire Sizes are from .0007” dia., to .003” dia. (18 – 75 Micron Diameter) Gold. •Finished Ball size as small as 0.002” (50 micron) diameter.
Product Specification| Specifications | | Wire | Gold = 17.5µ to 75µ Spool = 2" |
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| Bonding Area | Value |
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| Throat Depth | 143mm (5.6 inch) |
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| Gross Table Motion | 140mm (5.5 inch) |
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| Fine Table Motion | 14mm (0.55 inch) |
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| Mouse Ratio | 6:1 |
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| Z-Motion System | DC servo/LVDT control |
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| Z Travel | 9.1mm |
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| Ultrasonic System | High Q 60kHz transducer PLL ultrasonic generator |
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| Low Ultrasonic power | 1.3W |
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| High Ultrasonic Power | 2.5W |
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| Bond Time | 10-100 mSec / 10-1000 mSec |
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| Single Point TAB | Available |
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| Bond Force | Force coil 10-160g |
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| Modes of Operation | Value |
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| Possible Options: | | Microscopes and eyepieces | |
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| Deep access kit for 500 mil Z travel | |
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| Manual height adjustable, heated workholders | |
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| Spot light target | |
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